Dicing Tape
TOREVAS™ CF634 Series – Advanced Dicing Tape for Semiconductor Processing
The TOREVAS™ CF634 series is an innovative pressure-sensitive adhesive dicing tape developed for next-generation semiconductor manufacturing. Designed using co-extrusion technology, it offers superior cleanliness, excellent adhesive stability, and an eco-conscious formulation — making it an ideal alternative to conventional PVC tapes.
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Key Features
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Low Residue: Co-extrusion multilayer film leaves minimal adhesive residue after removal.
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Solvent-Free Manufacturing: No organic solvents used during production.
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PVC-Free: Environmentally friendly; no plasticizers involved.
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Stable Adhesion: Heat treatment at 95°C for 15–30 minutes stabilizes adhesive strength.
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IR Laser Transparency: CF634H supports IR-LASER processes at λ0.82μm.
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Application Highlights
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Wafer Dicing: Compatible with blade and stealth dicing.
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Metal-Coated Wafers: High adhesion on Au and Ag plating post-heat treatment.
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Wafer Expansion: Achieves up to 5% elongation under standard expansion conditions.
Proven Reliability
Already adopted by major global semiconductor manufacturers, the CF634 series is positioned as a practical and eco-conscious solution for advanced dicing needs.
🔬 Ideal for front-end semiconductor processes demanding high purity and stable adhesion.
